Welcome to the website for the 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)
The International Symposium for Design and Technology in Electronic Packaging (SIITME) is a premier Central European event in the field of electronics industry, being from 1995 a scientific forum for exchanging of information between academia and industry from Central and Eastern Europe on the topics related to their experimental and theoretical work in the field of electronics and micro-systems, manufacturing technologies and advanced packaging.
The symposium combines the oral and poster presentations, in an attractive configuration, as well as individual meetings between professors, students, senior and young scientists who can discuss scientific and educational issues and organize future national and international cooperation. It is our pleasure to encourage you to participate to SIITME 2010, organized by The University of Pitesti and Politehnica University of Bucharest, a top class, four days scientific event.
| Paul SVASTA | Dan PITICÄ‚ | Ioan LITA |
| General Chair | General Co Chair | Conference Chair |
 |
Hungarian & Romanian Joint Chapter |
| SIITME event is technically sponsored by IEEE CPMT Society. Its Conference Proceedings will include papers accepted by the Scientific Committee after a carefully review. The presented papers will be included in the ISI data base IEEE Xplore DIGITAL LIBRARY. |
Call for Papers
Joint Events
Microsystems Workshop [.PDF] Thursday, September 23, 14 – 20
Transmission Line Animations in MATLAB [.PDF] Thursday, September 23, 16 – 20
