Welcome to the website for the 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)

The International Symposium for Design and Technology in Electronic Packaging (SIITME) is a premier Central European event in the field of electronics industry, being from 1995 a scientific forum for exchanging of information between academia and industry from Central and Eastern Europe on the topics related to their experimental and theoretical work in the field of electronics and micro-systems, manufacturing technologies and advanced packaging.

The symposium combines the oral and poster presentations, in an attractive configuration, as well as individual meetings between professors, students, senior and young scientists who can discuss scientific and educational issues and organize future national and international cooperation. It is our pleasure to encourage you to participate to SIITME 2012, organized by “1 DECEMBRIE 1918″ University of Alba Iulia and Politehnica University of Bucharest, a top class, four days scientific event.

Hungarian & Romanian Joint Chapter

SIITME event is technically sponsored by IEEE CPMT Society. Its Conference Proceedings will include papers accepted by the Scientific Committee after a carefully review. The presented papers will be included in the ISI data base IEEE Xplore DIGITAL LIBRARYHowever, please remember that you should sign the copyrigth form and thus state: “The undersigned hereby warrants that the Work and Presentation are original and that he/she is the author of the Materials. “, and be notified that the originality of the papers will be checked, and if it fails, the paper may be excluded from the IEEE Xplore proceedings without further notice.Please note: electronic submission only. Submit the abstracts to:
http://www.siitme.ro/submission.